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Process Engineer - Die Bonding

Avo Photonics, Horsham, PA, United States
Employer Description

Avo Photonics (www.avophotonics.com) is a dynamic contract engineering services company that designs, develops and manufactures custom opto-electronic products for a large customer base. Members of our staff have the opportunity to design, prototype, and produce next generation products for a diverse range of markets including environmental, medical, military, industrial, aerospace, and communications.

Job Description

We seek a diligent, dedicated and meticulous person who will help further our success and reputation in the industry through world-class customer service. The successful candidate must plan his/her work schedule, keep multiple records, be self-motivated, maintain a professional presence, and have the desire to take ownership. 

Responsibilities:

  • Develop automated routines for die placement using fiducials on submount and chip.
  • Optimize die bonding parameters using DOE approach.
  • Perform die shear tests to validate process.
  • Create documentation and provide training on resultant processes to production personnel.
  • Troubleshoot die bonding equipment.
  • Understand and provide solder stack recommendations for optomechanical assemblies.
  • Define and implement preventive maintenance protocols for multiple die bonders.
  • Maintain and expand database of process parameters and fixtures for developed processes.
Job Requirements

Requirements:

  • B.S. in Engineering or Science field.
  • Three years of experience working with die bonding equipment.
  • Experience in DOE and SPC.
  • Good communication skills and willingness to learn.

Apply: Avo Photonics offers competitive salaries and a comprehensive benefits package. 

JOB DETAILS
POSTED
22 January 2024
CLOSES
22 March 2024
JOB TYPE
Full-Time
REQUIRED EDUCATION
Bachelor's Degree
ANNUAL SALARY
Open
JOB FUNCTION
Engineer
FIELD
Optical Components, Lasers, Sensors